Display substrate and method for manufacturing the same, display device

ABSTRACT

A display substrate, a method for manufacturing a display substrate and a display device are provided, and the display substrate includes: a base having a first surface, a second surface and a side surface, the base includes a display area and an epitaxial area; a driving functional layer in the display area and first binding electrodes in the epitaxial area on the first surface, the first binding electrodes are coupled with the driving functional layer; second binding electrodes located on the second surface and coupled with the first binding electrodes through side wirings; a portion of each side wiring is located on the side surface; a blocking wall on the first surface and in the epitaxial area, an orthographic projection of the blocking wall on the base at least passes through spacing regions between every two adjacent first binding electrodes along an arrangement direction of the first binding electrodes.

This is a continuation application of U.S. patent application Ser. No.17/354,122, filed on Jun. 22, 2021, which claims the priority of theChinese Patent Application No. 202010866854.3 filed on Aug. 25, 2020,the content of which is incorporated herein by reference in itsentirety.

CROSS REFERENCE TO RELATED APPLICATIONS

The present application claims priority to Chinese patent applicationNo. 202010866854.3 filed at the Chinese Intellectual Property Office onAug. 25, 2020, the contents of which is incorporated herein by referencein its entirety.

TECHNICAL FIELD

The present disclosure relates to the field of display technology, inparticular to a display substrate, a manufacturing method of a displaysubstrate and a display device.

BACKGROUND

The Micro/Mini light emitting diode (Micro/Mini-LED) display technology,as a new generation display technology, has advantages of highbrightness, good light emitting efficiency, low power consumption, andthe like. Generally, a Micro/Mini-LED chip is transferred to a displaysubstrate by a transferring technology, and due to a limitation of thetransferring technology, a large-sized LED display substrate cannot bedirectly prepared; therefore, in the related art, a plurality ofsmall-sized LED display substrates are spliced in a splicing manner toform a large-sized display substrate.

SUMMARY

Embodiments of the disclosure provide a display substrate, a method formanufacturing a display substrate and a display device.

An embodiment of the present disclosure provides a display substrate,including:

-   -   a base having a first surface, a second surface, and a side        surface, the first surface being opposite to the second surface,        the side surface being connected between the first surface and        the second surface, the base including a display area and an        epitaxial area at a side of the display area;    -   a driving functional layer and a plurality of first binding        electrodes, which are located on the first surface of the base,        the driving functional layer is located in the display area, and        the first binding electrodes are located in the epitaxial area        and are electrically coupled with the driving functional layer;    -   a plurality of second binding electrodes located on the second        surface of the base and connected with the plurality of first        binding electrodes in a one-to-one correspondence through side        wirings; a portion of each side wiring is located on the side        surface of the base;    -   a blocking wall located on the first surface of the base, the        blocking wall is located in the epitaxial area, and an        orthographic projection of the blocking wall on the base at        least passes through spacing regions between every two adjacent        first binding electrodes along an arrangement direction of the        first binding electrodes.

In some implementations, an orthographic projection of the blocking wallon the base is a continuous pattern, a portion of the blocking wall islocated on a side of the first binding electrodes away from the base,and the rest of the blocking wall is located in the spacing regionsbetween every two adjacent first binding electrodes.

In some implementations, an orthographic projection of the blocking wallon the base does not overlap with orthographic projections of the firstbinding electrodes on the base.

In some implementations, a distance between the blocking wall and aboundary of the display area is 0.08 to 0.2 times a width of theepitaxial region.

In some implementations, each first binding electrode includes: anelectrode main body part and a transmission part, the transmission partis coupled between the electrode main body part and the drivingfunctional layer, a conductive protection layer is arranged on a side,away from the base, of the electrode main body part, and a portion ofthe side wiring is located on a side, away from the base, of theconductive protection layer and coupled with the conductive protectionlayer.

In some implementations, edges of a plurality of conductive protectionlayers proximal to the display area are located on a first boundary, andthe blocking wall is located between the display area and the firstboundary.

In some implementations, a distance between the blocking wall and thefirst boundary is 0.04 to 0.1 times a width of the epitaxial area, and adistance between the blocking wall and a boundary of the display area is0.08 to 0.15 times the width of the epitaxial area.

In some implementations, the display substrate further includes aplurality of light emitting devices, and the drive functional layerincludes:

-   -   a first conductive pattern including a plurality of signal        transmission lines coupled to the first binding electrodes;    -   a first insulating layer located on a side, away from the base,        of the first conductive pattern;    -   a second conductive pattern located on a side, away from the        base, of the first conductive pattern and including a plurality        of coupling electrodes, and the coupling electrodes are coupled        with the signal transmission lines through first via holes in        the first insulating layer;    -   a second insulating layer located on a side, away from the base,        of the second conductive pattern;    -   pins of the light emitting devices are coupled to the coupling        electrodes through second via holes in the second insulating        layer, and a surface, away from the base, of the blocking wall        is not lower than a surface, away from the base, of the second        insulating layer.

In some implementations, the blocking wall includes a first blockingwall portion and a second blocking wall portion, the first blocking wallportion and the first insulating layer are disposed in a same layer, andthe second blocking wall portion and the second insulating layer aredisposed in a same layer.

In some implementations, the first blocking wall portion includes afirst blocking layer and a second blocking layer sequentially disposedalong a direction away from the base.

In some implementations, the second blocking wall portion includes athird blocking layer, a fourth blocking layer, and a fifth blockinglayer sequentially disposed along the direction away from the base.

In some implementations, the first insulating layer includes a firstinorganic layer and a first organic layer sequentially disposed along adirection away from the base, and the second insulating layer includes asecond inorganic layer, a second organic layer, and a third inorganiclayer sequentially disposed along the direction away from the base.

In some implementations, the first blocking layer is disposed in thesame layer as the first inorganic layer, and the second blocking layeris disposed in the same layer as the first organic layer.

In some implementations, the third blocking layer is disposed in thesame layer as the second inorganic layer, the fourth blocking layer isdisposed in the same layer as the second organic layer, and the fifthblocking layer is disposed in the same layer as the third inorganiclayer.

In some implementations, a height of a surface of the blocking wall awayfrom the base is 1 to 1.3 times a height of a surface of the secondinsulating layer away from the base.

An embodiment of the present disclosure further provides a displaydevice, including the display substrate described above.

An embodiment of the present disclosure further provides a method formanufacturing a display substrate, including the following steps:

-   -   providing a base having a first surface, a second surface, and a        side surface, the first surface being opposite to the second        surface, the side surface being connected between the first        surface and the second surface, the base including a display        area and an epitaxial area at a side of the display area;    -   forming a driving functional layer and a plurality of first        binding electrodes on the first surface of the base, where the        driving functional layer being located in the display area, and        the plurality of first binding electrodes being located in the        epitaxial area and electrically coupled with the driving        functional layer;    -   forming a plurality of second binding electrodes on the second        surface of the base, the plurality of second binding electrodes        corresponding to the plurality of first binding electrodes one        to one;    -   forming a blocking wall on the first surface of the base, where        the blocking wall being positioned in the epitaxial area, and an        orthographic projection of the blocking wall on the base at        least passes through spacing regions between every two adjacent        first binding electrodes along an arrangement direction of the        first binding electrodes; and    -   forming side wirings being in one-to-one corresponding coupling        with the first binding electrodes on the base formed with the        blocking wall, where the second binding electrodes being coupled        with the first binding electrodes through the side wirings one        to one; a portion of each side wiring being located on the side        surface of the base.

DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the disclosure and are incorporated in and constitute apart of this specification, illustrate embodiments of the disclosure andtogether with the description serve to explain the disclosure, but donot constitute a limitation of the disclosure. In the drawings:

FIG. 1 is a schematic diagram of a first surface of a base of a displaysubstrate in an embodiment of the present disclosure.

FIG. 2 is a schematic diagram of a second surface of a base of a displaysubstrate in an embodiment of the present disclosure.

FIG. 3 is an overall sectional view taken along line A-A′ of FIG. 1 .

FIG. 4 is a plan view of an epitaxial area on a first surface of a basein an embodiment of the present disclosure.

FIG. 5 is another plan view of an epitaxial area on a first surface of abase in an embodiment of the present disclosure.

FIG. 6 is a sectional view taken along line B-B′ of FIG. 4 .

FIG. 7 is a sectional view taken along line C-C′ of FIG. 4 .

FIG. 8 is a schematic structural diagram of a display substrate in anembodiment of the present disclosure.

FIG. 9 is a flowchart of a method for manufacturing a display substrateaccording to an embodiment of the disclosure.

DETAILED DESCRIPTION

To make the objects, technical solutions and advantages of theembodiments of the present disclosure more apparent, the technicalsolutions of the embodiments of the present disclosure will be clearlyand completely described below with reference to the drawings of theembodiments of the present disclosure. It is to be understood that thedescribed embodiments are only a few embodiments of the presentdisclosure, and not all embodiments. All other embodiments, which can bederived by a person skilled in the art from the described embodiments ofthe disclosure without creative labor, are within the protection scopeof the present disclosure.

Unless defined otherwise, technical or scientific terms used hereinshall have the ordinary meaning as understood by one of ordinary skillin the art to which the present disclosure belongs. The use of “first”,“second” and the like in the present disclosure is not intended toindicate any order, quantity, or importance, but rather is used todistinguish one element from another. Also, the use of the terms “a”,“an” or “the” and similar referents does not denote a limitation ofquantity, but rather denotes the presence of at least one. The word“include” or “comprise”, and the like, is intended to mean that theelement or item preceding the word contains the element or item listedafter the word and its equivalent, but not the exclusion of otherelements or items. The terms “coupled” or “connected” and the like arenot restricted to physical or mechanical connections, but may includeelectrical connections, whether direct or indirect. The positionalrelationship words “upper” and the like are used merely to indicaterelative positional relationships, which may change accordingly when anabsolute position of the object being described changes.

In the following description, when an element or layer is referred to asbeing “on” or “connected to” another element or layer, it can bedirectly on or connected to another element or layer, or interveningelements or layers may be present. However, when an element or layer isreferred to as being “directly on” or “directly connected to” anotherelement or layer, there are no intervening elements or layers present.The term “and/or” includes any and all combinations of one or more ofthe associated listed items.

Although the terms first, second, etc. may be used herein to describevarious elements, components, regions, layers and/or sections, theseelements, components, regions, layers and/or sections should not belimited by these terms. These terms are used to distinguish one element,component, region, layer or section from another element, component,region, layer or section.

A small-sized display substrate generally includes a display area and anepitaxial area, where first binding electrodes are arranged in theepitaxial area, and the first binding electrodes are connected withsecond binding electrodes on a back side of the display substratethrough wires on a side surface of the display substrate and thencoupled with a flexible circuit board. When the wires are formed on theside surface of the display substrate, conductive materials easily enterthe display area, so that short circuit occurs between conductivestructures in the display area, and the yield of the display substrateis affected.

FIG. 1 is a schematic diagram of a first surface of a base of a displaysubstrate in an embodiment of the present disclosure, FIG. 2 is aschematic diagram of a second surface of the base of the displaysubstrate in an embodiment of the present disclosure, and FIG. 3 is anoverall sectional view taken along a line A-A′ in FIG. 1 . As shown inFIGS. 1 to 3 , the display substrate includes: a base 10, a drivingfunctional layer 20, a plurality of first binding electrodes 30, aplurality of second binding electrodes 40, and a plurality of sidewirings 50. The base 10 has a first surface 10 a, a second surface 10 b,and a side surface 10 c, where the first surface 10 a and the secondsurface 10 b are two opposite surfaces of the base 10, and the sidesurface 10 c is connected between the first surface 10 a and the secondsurface 10 b. The base 10 includes a display area DA and an epitaxialarea WA located at a side of the display area DA. As an example, thebase 10 may be a glass base 10.

The driving functional layer 20 and the plurality of first bindingelectrodes 30 are disposed on the first surface 10 a of the base 10, thedriving functional layer 20 is located in the display area DA, and thefirst binding electrodes 30 are located in the epitaxial area WA andelectrically coupled to the driving functional layer 20. Light emittingdevices may be disposed on the driving functional layer 20, and thedriving functional layer 20 is configured to provide a driving signal tothe light emitting devices to drive the light emitting devices to emitlight. The light emitting devices may be light emitting diodes, such asMini-LEDs or Micro-LEDs.

The second binding electrodes 40 are disposed on the second surface 10 bof the base 10, the second binding electrodes 40 are coupled to thefirst binding electrodes 30 in a one-to-one correspondence through sidewirings 50, and a portion of each of the side wirings 50 is located onthe side surface of the base 10. In some implementations, as shown inFIGS. 2 and 3 , the second surface 10 b of the base 10 may further beprovided with third binding electrodes 70 coupled to the second bindingelectrodes 40 in a one-to-one correspondence manner, and the thirdbinding electrodes 70 are used for binding with a flexible printedcircuit (FPC) so as to provide driving signals from a driving chip onthe FPC to the driving functional layer 20.

In a process of manufacturing the display substrate, when the sidewirings 50 are formed, a magnetron sputtering process or anelectroplating process may be used to form a metal film layer, and thenthe metal film layer is etched, so that a plurality of side wirings 50are formed. During etching, a laser etching method may be adopted. Inorder to avoid damage to the structures in the display area DA caused byheat generated during laser etching, when the metal film layer isformed, a blocking film may be attached to the display area DA, then themetal film layer is formed, and after the metal film layer is formed,the blocking film is peeled off. However, in an actual operation, theblocking film is not closely attached to the display area DA, so thatsome metal ions still enter the display area DA, and a short circuitoccurs between different first binding electrodes 30.

To solve this problem, as shown in FIGS. 1 and 3 , an embodiment of thepresent disclosure provides a blocking wall 60 on the first surface 10 aof the base 10, the blocking wall 60 is located in the epitaxial regionWA, and an orthographic projection of the blocking wall 60 on the base10 at least passes through spacing regions between every two adjacentfirst binding electrodes 30 along an arrangement direction of the firstbinding electrodes 30. The plurality of first binding electrodes 30 arearranged in a first direction in FIG. 1 .

It should be noted that, the orthographic projection of the blockingwall 60 on the base 10 at least passes through the spacing regionbetween every two adjacent first binding electrodes 30 along thearrangement direction of the plurality of first binding electrodes 30,which means that the blocking wall 60 at least includes first blockingportions located between every two adjacent first binding electrodes 30,and an orthographic projection of each first blocking portion on thebase 10 extends from an orthographic projection of one first bindingelectrode 30 on the base 10 to an orthographic projection of anotherfirst binding electrode 30 on the base 10.

In an implementation, the blocking wall 60 is disposed in the epitaxialregion WA, and the blocking wall 60 is at least located in the spacingregion between two adjacent first binding electrodes 30, so that whenthe metal film layer is formed in the epitaxial region WA, under theblocking effect of the blocking wall 60, metal ions cannot enter thedisplay region DA from the spacing region between two adjacent firstbinding electrodes 30, thereby preventing a short circuit between twoadjacent first binding electrodes 30, and ensuring the yield of thedisplay substrate.

FIG. 4 is a plan view of an epitaxial region on the first surface of thebase according to an embodiment of the present disclosure, as shown inFIG. 4 , in some implementations, the orthographic projection of theblocking wall 60 on the base 10 is a continuous pattern, a portion ofthe blocking wall 60 is located on a side of the first bindingelectrodes 30 away from the base 10, and the rest of the blocking wall60 is located in spacing regions between every two adjacent firstbinding electrodes 30.

FIG. 5 is another plan view of the epitaxial region on the first surfaceof the base in an embodiment of the present disclosure, as shown in FIG.5 , in other implementations, the blocking wall 60 includes a pluralityof blocking portions disposed at intervals, and an orthographicprojection of each blocking portion on the base 10 is located in thespaced region between two adjacent first binding electrodes 30, that is,the orthographic projection of the blocking wall 60 on the base 10 doesnot overlap with the orthographic projection of the first bindingelectrodes 30 on the base 10.

FIG. 6 is a sectional view taken along the line B-B ‘of FIG. 4 , andFIG. 7 is a sectional view taken along the line C-C’ of FIG. 4 . In thisregard, for the blocking wall 60 shown in FIG. 5 , a longitudinalsectional structure thereof can be seen in FIG. 7 . As shown in FIG. 6 ,the first binding electrode 30 includes an electrode main body part 30 aand a transmission part 30 b, the transmission part 30 b is coupledbetween the electrode main body part 30 a and the driving functionallayer 20, a conductive protection layer 31 is arranged on a side of theelectrode main body part 30 a away from the base 10, and a portion ofthe side wiring 50 is located on a side of the conductive protectionlayer 31 away from the base 10 and is in contact with and coupled withthe conductive protection layer 31. The conductive protection layer 31is made of a metal oxide conductive material, and the conductiveprotection layer 31 can prevent the electrode main body portion 30 afrom being oxidized to affect conductivity. In addition, since theelectrode main body portion 30 a and the side wirings 50 need to beelectrically coupled, the conductive protection layer 31 needs to beable to protect the electrode main body portion 30 a from oxidation andto have a certain conductivity. In some examples, the electrode mainbody portion 30 a and the transmission portion 30 b are of an integratedstructure in a single piece, e.g., both of them are made of copper. Thematerial of the conductive protection layer 31 includes a metal oxidematerial with a better conductivity, such as indium tin oxide, indiumgallium zinc oxide, etc.

As shown in FIGS. 4 and 5 , in some implementations, a distance L1between the blocking wall 60 and a boundary of the display area DA is0.08 to 0.2 times a width w of the epitaxial area WA. For example, thewidth w of the epitaxial region WA is 120 μm, and the distance L1between the blocking wall 60 and the boundary of the display area DA isbetween 10 μm and 24 μm, so that a certain distance is reserved betweenthe metal film layer formed by sputtering and the boundary of thedisplay area DA when the side wirings 50 are manufactured, and thus,when the metal film layer is etched by laser, the structures of thedisplay area DA are prevented from being damaged by heat generated byetching, and an excessively large bezel cannot be formed.

It should be noted that, in an implementation, the display substratefurther includes a plurality of light emitting devices disposed on thedriving functional layer 20. The light emitting devices may be arrangedin an array, and the boundary of the display area DA is a boundary of anarea where the light emitting devices are located. The longitudinaldirection of the epitaxial area WA is the arrangement direction of theplurality of first binding electrodes 30, and the width direction of theepitaxial area WA is an arrangement direction of the electrode main bodyportion 30 a and the transmission portion 30 b of the first bindingelectrode 30.

An outline of the conductive protection layer 31 on each first bindingelectrode 30 is a quadrangle including opposite first and second edges,and two side edges connected between the first and second edges, wherethe first edge is an edge of the conductive protection layer 31 proximalto the display area DA, and the second edge is an edge of the conductiveprotection layer 31 away from the display area DA. In someimplementations, first edges of conductive protection layers 31 arelocated in a same straight line, which is referred to as a firstboundary. In some implementations, the blocking wall 60 may be locatedon the first boundary.

In some other implementations, as shown in FIG. 5 , the blocking wall 60is located between the display area DA and the first boundary, so as toprevent the providing of the blocking wall 60 from affecting thecoupling between the conductive protection layer 31 and the side wiring50, so as to ensure the coupling stability between the side wiring 50and the conductive protection layer 31. In some implementations, adistance L2 between the blocking wall 60 and the first boundary is 0.04to 0.1 times the width w of the epitaxial area WA, and a distancebetween the blocking wall 60 and the boundary of the display area DA is0.08 to 0.15 times the width w of the epitaxial area WA. For example,the width w of the epitaxial region WA is 120 μm, the distance L1between the blocking wall 60 and the boundary of the display area DA is10 μm, and the distance L2 between the blocking wall 60 and the firstboundary is 5 μm.

FIG. 8 is a schematic structural diagram of a display substrate in anembodiment of the present disclosure, and as shown in FIGS. 6 to 8 , thedriving functional layer 20 includes: a first conductive patternincluding a plurality of signal transmission lines 21/22, a firstinsulating layer 23, a second conductive pattern, and a secondinsulating layer 25, the signal transmission lines 21/22 being coupledto the first binding electrodes 30 in a one-to-one correspondence, wherethe signal transmission lines 21/22 may be coupled to transmission parts30 b of the first binding electrodes 30. The signal transmission lines21/22 and the first binding electrodes 30 may be disposed in a samelayer. It should be noted that the term “disposed in a same layer” inthe embodiments of the present disclosure means that two structures canbe manufactured by a single patterning process, and therefore, the twostructures are in the same layer in the overlapping relationship, butthis does not mean that distances between the two structures and thebase 10 are necessarily the same. When the two structures are disposedin the same layer and coupled, they may be formed as an integralstructure in a single piece. It should be further noted that thestructure shown in FIG. 8 is not obtained by cutting along the signaltransmission lines 21/22, and therefore, in FIG. 8 , a portion of thesignal transmission line 21/22 located below a second via hole V1/V2 isspaced apart from the first binding electrode 30, and the signaltransmission line 21/22 may be coupled with the first binding electrode30 at a position not shown in FIG. 8 .

The first insulating layer 23 is disposed on a side of the firstconductive pattern away from the base 10, where the first insulatinglayer 23 may include a first inorganic layer 23 a and a first organiclayer 23 b, the first inorganic layer 23 a is disposed between the firstorganic layer 23 b and the base 10, and the first inorganic layer 23 ahas a function of blocking moisture and oxygen, so as to improve thesealing property of the display substrate and prevent the firstconductive pattern from being corroded by moisture and oxygen. The firstinorganic layer 23 a may be made of an inorganic material such assilicon nitride or silicon oxynitride, or may be made of anotherinorganic material, which is not limited herein. The first organic layer23 b may be made of an organic resin material, or may be made of anotherorganic material, which is not limited herein.

The second conductive pattern is disposed on a side of the firstconductive pattern away from the base 10, the second conductive patternincludes a plurality of coupling electrodes 24 a/24 b, the couplingelectrodes 24 a are coupled to the signal transmission lines 21 throughfirst via holes in the first insulating layer 23, and the couplingelectrodes 24 b are coupled to the signal transmission lines 22 throughfirst via holes in the first insulating layer 23. The second insulatinglayer 25 is disposed on a side of the second conductive pattern awayfrom the base 10, and the second insulating layer 25 may include: asecond inorganic layer 25 a, a second organic layer 25 b, and a thirdinorganic layer 25 c, the second inorganic layer 25 a is arrangedbetween the second organic layer 25 b and the base 10, the thirdinorganic layer 25 c is arranged on a side of the second organic layer25 b away from the base 10, and the second inorganic layer 25 a and thethird inorganic layer 25 c have the effect of blocking moisture andoxygen, so that the sealing performance of the display substrate isimproved, and the second conductive pattern is prevented from beingcorroded by moisture and oxygen. The second inorganic layer 25 a and thethird inorganic layer 25 c may be made of an inorganic material such assilicon nitride or silicon oxynitride, or may be made of anotherinorganic material, which is not limited herein. The second organiclayer 25 b may be made of an organic resin material, or may be made ofother organic materials, which is not limited herein. In practicalapplications, the film layer structures specifically included in thefirst insulating layer 23 and the second insulating layer 25 may beincreased or decreased according to actual needs, and are notparticularly limited herein.

The second insulating layer 25 is provided with second via holes V1/V2therein, and the second via holes V1/V2 correspond to the light emittingdevices one to one and correspond to the coupling electrodes 24 a/24 bone to one. Pins of the light emitting device include a cathode pin andan anode pin, the second via hole V1 corresponds to the anode pin of thelight emitting device, and the second via hole V2 corresponds to thecathode pin of the light emitting device. The second via hole V1 exposesa portion of the corresponding coupling electrode 24 a, the second viahole V2 exposes a portion of the corresponding coupling electrode 24 b,the anode pin of the light emitting device is coupled to the couplingelectrode 24 a through the second via hole V1, and the cathode pin ofthe light emitting device is coupled to the coupling electrode 24 bthrough the second via hole V2.

In some implementations, a buffer layer 26 may be further disposed onthe base 10, and both the first conductive pattern and the first bindingelectrodes 30 are located on a side of the buffer layer 26 away from thebase 10. The buffer layer 26 is configured to improve bonding firmnessbetween the first conductive pattern, the first binding electrodes 30,and the base 10. The buffer layer 26 may be made of an inorganicmaterial such as silicon nitride or silicon oxynitride, or may be madeof another inorganic material, which is not limited herein.

In order to prevent the second binding electrodes 40 and the thirdbinding electrodes 70 from being oxidized, a conductive protection layer41 is disposed on surfaces of the second binding electrodes 40 away fromthe base 10, and a conductive protection layer 71 is disposed onsurfaces of the third binding electrodes 70 away from the base 10, andthe conductive protection layer 71 is coupled to the side wirings 50.The material of the conductive protection layers 41 and 71 may include ametal oxide material with a better conductivity, such as indium tinoxide, indium gallium zinc oxide, etc. In addition, a passivation layer80 is further disposed on a side of the base 10 away from the drivingfunctional layer 20, and a portion of the conductive protection layer 71is exposed by the passivation layer 80, so that the conductiveprotection layer 71 is bonded to the flexible circuit board.

In some implementations, a height h1 of a surface of the blocking wall60 away from the base 10 is 1 to 1.3 times a height h2 of a surface ofthe second insulating layer 25 away from the base 10, so as to ensurethat the metal ions cannot enter the display area DA when the sidewirings 50 are manufactured. It should be noted that, in the embodimentof the present disclosure, the height of a certain surface refers to: aperpendicular distance from the certain surface to a surface of the base10 proximal thereto.

In some specific examples, the height h2 of the surface of the secondinsulating layer 25 away from the base 10 ranges from 3.5 μm to 4.5 μm,and the height h1 of the surface of the blocking wall 60 away from thebase 10 ranges from 3.5 μm to 6 μm. For example, the height h1 of thesurface of the blocking wall 60 away from the base 10 and the height h2of the surface of the second insulation layer 25 away from the base 10each are 4 μm.

In some implementations, as shown in FIGS. 6 to 8 , the blocking wall 60includes a first blocking wall portion 61 and a second blocking wallportion 62 which are stacked, the first blocking wall portion 61 and thefirst insulating layer 23 are disposed in a same layer, and the secondblocking wall portion 62 and the second insulating layer 25 are disposedin a same layer. As above, the first insulating layer 23 may include thefirst inorganic layer 23 a and the first organic layer 23 b, and thesecond insulating layer 25 may include the second inorganic layer 25 a,the second organic layer 25 b, and the third inorganic layer 25 c, insuch case, the first blocking wall portion 61 may include: a firstblocking layer 61 a and a second blocking layer 61 b, the first blockinglayer 61 a is disposed in the same layer as the first inorganic layer 23a, and the second blocking layer 61 b is disposed in the same layer asthe first organic layer 23 b. The second blocking wall portion 62 mayinclude: a third blocking layer 62 a, a fourth blocking layer 62 b, anda fifth blocking layer 62 c, the third blocking layer 62 a is disposedin the same layer as the second inorganic layer 25 a, the fourthblocking layer 62 b is disposed in the same layer as the second organiclayer 25 b, and the fifth blocking layer 62 c is disposed in the samelayer as the third inorganic layer 25 c.

Certainly, the first blocking wall portion 61 may include only ablocking layer disposed in the same layer as the first organic layer 23b, and the second blocking wall portion 62 may include only a blockinglayer disposed in the same layer as the second organic layer 25 b.

FIG. 9 is a flowchart of a method for manufacturing a display substrateaccording to an embodiment of the present disclosure, and as shown inFIG. 9 , the method for manufacturing the display substrate includesfollowing steps S1 to S5.

At step S1, providing a base with a first surface, a second surface anda side surface, where the first surface is opposite to the secondsurface, the side surface is connected between the first surface and thesecond surface, and the base includes a display area and an epitaxialarea positioned at a side of the display area.

At step S2, forming a driving functional layer and a plurality of firstbinding electrodes on the first surface of the base, where the drivingfunctional layer is located in the display area, and the first bindingelectrodes are located in the epitaxial area and electrically coupledwith the driving functional layer.

At step S3, forming a plurality of second binding electrodes on thesecond surface of the base, where the second binding electrodescorrespond to the first binding electrodes one to one.

It should be noted that, the sequence of step S2 and step S3 is notparticularly limited, and step S2 may be performed before step S3, ormay be performed after step S3.

At step S4, forming a blocking wall on the first surface of the base,where the blocking wall is located in the epitaxial area, and anorthographic projection of the blocking wall on the base at least passesthrough spacing regions between every two adjacent first bindingelectrodes along an arrangement direction of the first bindingelectrodes.

At step S5, forming side wirings, which are coupled with the firstbinding electrodes one to one, on the base formed with the blockingwall, where the second binding electrodes are coupled with the firstbinding electrodes one to one through the side wirings; a portion ofeach side wiring is located on the side surface of the base.

Before the step S5, a blocking film may be attached to the display area,and when the step S5 is performed, a metal film layer may be formed inthe epitaxial area on the first surface, the side surface of the base,and the second surface of the base by a magnetron sputtering, and then,laser etching is performed on the metal film layer, so as to form theside wirings coupled to the first binding electrodes in a one-to-onecorrespondence manner.

Under the blocking effect of the blocking wall, when the metal filmlayer is formed by magnetron sputtering in step S5, metal ions cannotenter the display area through the spacing region between the firstbinding electrodes, thereby preventing the short circuit betweendifferent first binding electrodes caused by difficulty in etching themetal film layer in the display area.

As described above, the driving functional layer includes: a firstconductive pattern, a first insulating layer, a second conductivepattern, and a second insulating layer; the blocking wall includes afirst blocking wall portion and a second blocking wall portion. In thiscase, the first conductive pattern may be formed in synchronization withthe first blocking wall portion, and the second blocking wall portionmay be formed in synchronization with the second insulating layer.

An embodiment of the present disclosure further provides a displaydevice, including the display substrate described above. In someimplementations, the display device may be any product or componenthaving a display function, such as a mobile phone, a tablet computer, atelevision, a display, a notebook computer, a digital photo frame, anavigator, and the like.

It will be understood that the above embodiments are merely exemplaryembodiments employed to illustrate the principles of the presentdisclosure, and the present disclosure is not limited thereto. It willbe apparent to those skilled in the art that various changes andmodifications can be made therein without departing from the spirit andscope of the disclosure, and these changes and modifications are to beconsidered within the scope of the disclosure.

1. A display substrate, comprising: a base having a first surface, asecond surface and a side surface, the first surface being opposite tothe second surface, the side surface being connected between the firstsurface and the second surface, the base including a display area and anepitaxial area at a side of the display area; a driving functional layerand a plurality of first binding electrodes, which are located on thefirst surface of the base, the driving functional layer being located inthe display area, and the first binding electrodes being located in theepitaxial area and electrically coupled with the driving functionallayer; a blocking wall located on the first surface of the base, whereinthe blocking wall comprises a plurality of blocking portions disposed atintervals, an orthographic projection of each of the plurality ofblocking portions on the base is located in a spacing region between twoadjacent first binding electrodes, and the plurality of blockingportions are disposed at intervals along an arrangement direction of thefirst binding electrodes; the display substrate further comprises aplurality of light emitting devices, and the driving functional layercomprises: a first conductive pattern comprising a plurality of signaltransmission lines coupled to the first binding electrodes; a firstinsulating layer located on a side of the first conductive pattern awayfrom the base; a second conductive pattern located on a side of thefirst conductive pattern away from the base and comprising a pluralityof coupling electrodes, wherein the coupling electrodes are coupled tothe signal transmission lines through first via holes in the firstinsulating layer; and a second insulating layer located on a side of thesecond conductive pattern away from the base, wherein the blocking wallis arranged in a same layer as the first insulating layer and/or thesecond insulating layer.
 2. The display substrate of claim 1, wherein anorthographic projection of the blocking wall on the base is a continuouspattern, and besides the plurality of blocking portions, the blockingwall further comprises a portion located on a side of the first bindingelectrodes away from the base.
 3. The display substrate of claim 1,wherein an orthographic projection of the blocking wall on the base doesnot overlap with orthographic projections of the first bindingelectrodes on the base; and along the arrangement direction of the firstbinding electrodes, the orthographic projection of the blocking portionlocated in the spacing region between the two adjacent first bindingelectrodes on the base extends from an edge of an orthographicprojection of one of the two adjacent first binding electrodes on thebase to an edge of an orthographic projection of the other of the twoadjacent first binding electrodes on the base.
 4. The display substrateof claim 1, wherein the blocking wall comprises a first blocking wallportion and a second blocking wall portion which are stacked together,and the first blocking wall portion and the first insulating layer aredisposed in a same layer, and the second blocking wall portion and thesecond insulating layer are disposed in a same layer.
 5. The displaysubstrate of claim 1, wherein pins of the light emitting devices arecoupled to the coupling electrodes through second via holes in thesecond insulating layer, respectively.
 6. The display substrate of claim1, wherein a surface of the blocking wall away from the base is notlower than a surface of the second insulating layer away from the base.7. The display substrate of claim 6, wherein a height of the surface ofthe blocking wall away from the base is 1 to 1.3 times a height of thesurface of the second insulating layer away from the base.
 8. Thedisplay substrate of claim 4, wherein the first insulating layercomprises a first inorganic layer and a first organic layer sequentiallydisposed along a direction away from the base, and the second insulatinglayer comprises a second inorganic layer, a second organic layer, and athird inorganic layer sequentially disposed along the direction awayfrom the base.
 9. The display substrate of claim 8, wherein the firstblocking wall portion comprises a blocking layer which is arranged in asame layer as the first organic layer; and the second blocking wallportion comprises a blocking layer which is arranged in a same layer asthe second organic layer.
 10. The display substrate of claim 8, whereinthe first blocking wall portion comprises a first blocking layer and asecond blocking layer sequentially disposed along a direction away fromthe base; the second blocking wall portion comprises a third blockinglayer, a fourth blocking layer, and a fifth blocking layer sequentiallydisposed along the direction away from the base; and the first blockinglayer is disposed in a same layer as the first inorganic layer, thesecond blocking layer is disposed in a same layer as the first organiclayer, the third blocking layer is disposed in a same layer as thesecond inorganic layer, the fourth blocking layer is disposed in a samelayer as the second organic layer, and the fifth blocking layer isdisposed in a same layer as the third inorganic layer.
 11. The displaysubstrate of claim 1, further comprising a plurality of second bindingelectrodes located on the second surface of the base and connected withthe first binding electrodes in a one-to-one correspondence through sidewirings; wherein a portion of each of the side wirings is located on theside surface of the base.
 12. The display substrate of claim 1, whereina distance between the blocking wall and a boundary of the display areais 0.08 to 0.2 times a width of the epitaxial area.
 13. The displaysubstrate of claim 2, wherein a distance between the blocking wall and aboundary of the display area is 0.08 to 0.2 times a width of theepitaxial area.
 14. The display substrate of claim 1, wherein each ofthe first binding electrodes comprises an electrode main body part and atransmission part, the transmission part is coupled between theelectrode main body part and the driving functional layer, a conductiveprotection layer is arranged on a side of the electrode main body partaway from the base, and a portion of the side wiring is located on aside of the conductive protection layer away from the base and coupledwith the conductive protection layer.
 15. The display substrate of claim2, wherein each of the first binding electrodes comprises an electrodemain body part and a transmission part, the transmission part is coupledbetween the electrode main body part and the driving functional layer, aconductive protection layer is arranged on a side of the electrode mainbody part away from the base, and a portion of the side wiring islocated on a side of the conductive protection layer away from the baseand coupled with the conductive protection layer.
 16. The displaysubstrate of claim 14, wherein an edge of the conductive protectionlayer proximal to the display area is located on a first boundary, andthe blocking wall is located between the display area and the firstboundary.
 17. The display substrate of claim 15, wherein a distancebetween the blocking wall and the first boundary is 0.04 to 0.1 times awidth of the epitaxial area, and a distance between the blocking walland a boundary of the display area is 0.08 to 0.15 times the width ofthe epitaxial area.
 18. A display device, comprising the displaysubstrate of claim
 1. 19. The display device of claim 18, wherein anorthographic projection of the blocking wall on the base does notoverlap with orthographic projections of the first binding electrodes onthe base; and along the arrangement direction of the first bindingelectrodes, the orthographic projection of the blocking portion locatedin the spacing region between the two adjacent first binding electrodeson the base extends from an edge of an orthographic projection of one ofthe two adjacent first binding electrodes on the base to an edge of anorthographic projection of the other of the two adjacent first bindingelectrodes on the base.
 20. A method for manufacturing a displaysubstrate, comprising: providing a base having a first surface, a secondsurface and a side surface, the first surface being opposite to thesecond surface, the side surface being connected between the firstsurface and the second surface, the base comprising a display area andan epitaxial area at a side of the display area; forming a drivingfunctional layer and a plurality of first binding electrodes on thefirst surface of the base, wherein the driving functional layer beinglocated in the display area, and the plurality of first bindingelectrodes being located in the epitaxial area and electrically coupledwith the driving functional layer; forming a blocking wall on the firstsurface of the base, wherein the blocking wall comprises a plurality ofblocking portions disposed at intervals, an orthographic projection ofeach of the plurality of blocking portions on the base is located in aspacing region between two adjacent first binding electrodes, and theplurality of blocking portions are disposed at intervals along anarrangement direction of the first binding electrodes; and forming sidewirings, coupled with the first binding electrodes in a one-to-onecorrespondence, on the base provided with the blocking wall, wherein thesecond binding electrodes are coupled with the first binding electrodesthrough the side wirings, respectively, and a portion of each of theside wirings is located on the side surface of the base; and forming aplurality of light emitting devices, wherein forming the drivingfunctional layer comprises: forming a first conductive patterncomprising a plurality of signal transmission lines coupled to the firstbinding electrodes; forming a first insulating layer located on a sideof the first conductive pattern away from the base; forming a secondconductive pattern located on a side of the first conductive patternaway from the base and comprising a plurality of coupling electrodes,wherein the coupling electrodes are coupled to the signal transmissionlines through first via holes in the first insulating layer,respectively; and forming a second insulating layer located on a side ofthe second conductive pattern, away from the base, wherein the blockingwall is arranged in a same layer as the first insulating layer and/orthe second insulating layer.